Description
Primary Purpose of Role and key Responsibilities
This represents an excellent opportunity for an engineer wishing to start their career in a field-based role on key 300mm Advanced Packaging applications and 200mm Si, dielectric and GaAs etch applications.
Your main responsibility will be to
Provide onsite process development support on SPTS plasma etch and deposition modules, based at IMEC’s state-of-the art facility(as part of a 4-yr joint development programme on Advanced Packaging, GaN and BioMEMs).
Work closely with the Field Applications Manager to develop novel processes to meet both the needs of IMEC and future SPTS applications.
Generating and trialing new hardware concepts, modelling with commercial simulation software package, as well as carrying out hands-on process development and hardware testing.
Supporting customers on system performance by preparing reports and technical notes, presenting data at IMEC technical review seminars and building successful customer relationships. Good interpersonal skills should complement the capability to work with a high degree of autonomy.
This position will involve frequent travel to UK to participate in technical review meetings at SPTS .
Qualifications & Experience
Candidates must be educated to at the least BSC degree level, and ideally to Masters/PhD level in either a chemistry, physics or semiconductor technology field . Alternatively, applicants will have relevant experience of working with plasma etch or deposition equipment.
The successful candidate will have:
Good analytical skills including the ability to carry out metrology such as SEM
Knowledge of and ideally experience of using end point techniques
Good interpersonal and communication skills
Minimum Qualifications
Bachelor's Level Degree or work experience of 5 years
