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Die-to-Wafer Process Engineer

/Die-to-Wafer Process Engineer

Die-to-Wafer Process Engineer

Engineering - Leuven | Just now

We are looking for a Process Engineer focused on Die-to-Wafer (D2W) bonding to strengthen the MAterial Transfer (MAT) team.

Die-to-Wafer Process Engineer

What you will do

Die-To-Wafer (D2W) bonding is being used in different advanced packaging and heterogeneous integration schemes. This bonding technology enables the combination and integration of dies from various technology nodes, diverse heights and sizes, and different materials integrated in one package or system. Direct dielectric or hybrid copper/dielectric bonding is becoming an attractive method for D2W bonding as it allows to achieve a superior overlay accuracy due to the low force and room temperature bonding process.
 
As a member of the MAterial Transfer (MAT) team, you will be participating in optimizing the direct (hybrid) D2W bonding processes. The majority of your work will be executed in the cleanroom and you will be teamed up with R&D engineers to discuss and execute the bonding processes. You will be involved in multiple research activities where D2W bonding is required (. 3D, OIO, Chip Acts, Imagers…). You will work in a dynamic multidisciplinary and multicultural environment in close cooperation with researchers, engineers, operations, equipment vendors, industrial assignees, device and process experts.

 As a D2W Process Engineer you will be essential in helping to achieve the team’s goals and targets. More specifically, you will;

  • Organize and execute D2W bonding process development activities. 
  • Validate D2W bonding processes with all associated metrology (. overlay measurements, void detection). 
  • Summarise results focused on D2W bonding optimization. You will report progress, results, and opportunities to various organizational levels. 
  • Take up a significant hands-on role in the cleanroom. You will share the ownership of the bonding process with your direct colleagues, and you will have to improve the maturity level of the bonding process.
  • Work across team boundaries with integration, support and hardware teams. Being a team player is essential for this type of work.

    • What we do for you

    We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

    We are and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through y, 'our corporate university', we actively invest in your development to further your technical and personal growth. 

    We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits. 

    Who you are

  • You have a Master degree in Physics, Chemistry, Materials Science or Engineering (or equivalent through experience).
  • You are comfortable working in a team environment, but at the same time you can also work autonomously with minimal supervision when required.
  • You are eager to work in a highly competitive field and a multicultural environment. To allow you to function in this setting, you must be fluent in both written and spoken English.
  • You are eager to work hands-on in a clean room environment.
  • Having experience with bonding processes is a plus. In best case, you even have a basic understanding of other semiconductor manufacturing areas (., CMP, cleaning, plasma processes…)
  • Data analysis and/or simulation/modeling background is a plus (. Matlab, C/C++, Python, Comsol…)
  • Experience with bonding metrology is considered a plus.
  • You are innovative and creative in finding solutions to problems. You are passionate about application development, data interpretation and are focused on achieving high quality results.
  • You are organized and have a logical and methodical working style.

    • Who we are

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    Die-to-Wafer Process Engineer

    Entreprise:
    imec
    Ville:
    Leuven
    Type de contrat: 
    CDI, Temps plein
    Catégories: 
    Ingénieur Process Méthodes
    Diplôme: 
    Master
    Publiée:
    27.05.2024
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